Iziko leMishini
Isicelo:
Ukucola ipleyiti engasemva emva kokusika nge-laser. Ukuba usebenzisa umatshini wokusika nge-laser ukwenza imingxunya, ubungakanani bepleyiti engasemva buya kuba nomahluko omncinci, ngoko ke sisebenzisa iziko loomatshini ukucola ipleyiti engasemva njengesicelo sokuzoba.
Ukuhamba kweMveliso yePlate yoBuyiselo lwePC
Ukuhamba kweMveliso yePlate yeCV Back
Iingenelo Zethu:
Ukuqina okuqinileyo: Indawo ye-spindle yeziko loomatshini elithe nkqo iphezulu, kwaye ipleyiti engasemva ibotshelelwe kwibhentshi yokusebenzela, nto leyo eyenza inkqubo yoomatshini ibe ngqongqo ngakumbi kwaye ikwazi ukuphatha iipleyiti ezingasemva ezinzima ngakumbi kunye namandla aphezulu okusika.
Uzinzo oluhle loomatshini bokuchwetheza: Ngenxa yokuba indawo ephezulu ye-spindle yeziko loomatshini elithe nkqo, inkqubo yoomatshini bokuchwetheza kunye nokusika ipleyiti yangasemva izinzile ngakumbi, nto leyo enceda ekuphuculeni ukuchaneka koomatshini kunye nomgangatho womphezulu.
Ukusebenza okulula: Ukubopha izinto zokusebenza kunye nokutshintshwa kwezixhobo kwenziwa kumphezulu wokusebenza, okwenza kube lula kubasebenzisi ukujonga nokugcina.
Indawo encinci: Iziko loomatshini elithe nkqo linesakhiwo esincinci kunye nendawo encinci, nto leyo eyenza ukuba lifaneleke kwiindawo zokusebenzela ezinesithuba esincinci.
Ixabiso eliphantsi: Ukuba sisebenzisa umatshini wokubhoboza kwiprosesa esezantsi yepleyiti, kufuneka senze idayethi yokunyathela eqingqiweyo kwimodeli nganye, kodwa iziko loomatshini lifuna kuphela i-clamp yokubeka iipleyiti ezingasemva. Ingonga imali yokubumba kubathengi.
Ukusebenza kakuhle okuphezulu: Umsebenzi omnye unokulawula iiseti ezi-2-3 zeziko lokulungisa ngexesha elinye.